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geneva

GENEVA STP Series

Solder reflow with one-step processing by removing the need for flux. The end result is the replacement of a flux dispensing system, a large footprint belt furnace, and deflux machine in favor of the smaller, simpler, higher throughput, and lower cost of ownership

  • Process Applications : No Flux Solder Reflow, Screen Printing Bumps, Ball Placement, Caped Copper Pillar
  • Small footprint about 1/10th cleanroom space required compared to tradition line.
  • Low power consumption(12kW for 300mm machine)
  • One configuration reflows lead free, eutectic, and high lead solders
  • GENEVA has ability to remove or minimize voids during solder feflow
  • vienna

    VIENNA LTP Series

  • Small footprints
  • Oxide reduction formula
  • Interface oxide and by-product removal mechanism
  • Reliability specifications:
  • - MTBF > 150 hrs
    - MTTR < 3 hrs
    - Availability > 95%
    - Throughput (recipe dependent) > 60 pph
  • Temperature Range 100°C ~ 400°C
  • Ambient control: < 20 ppm O2
  • Substrate size: 316mm x 136mm
  • Processing pressure: atmospheric ~ vacuum
  • S2/ S8/ CE certified
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